Today, TI introduced two 3G chipsets, one for handsets and one for base stations. Although TI and other vendors have long offered handset chipsets, TI’s base station chipset is the first from a major semiconductor vendor. ASIC-plus-DSP designs dominate the base station market for a number of reasons, including high computational loads, power constraints, and cost pressures. Nonetheless, TI says the superior cost and performance of its chipset will enable it to displace ASIC-based designs.